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Dear Sir/Madam
At the moment the world is looking at Hanover Fair, still the largest industrial exhibition all over the world. And – surprisingly there is good news that the German automation industry is still leading in the world. This is enabled by powerful embedded computers which are developed and produced in Germany. Information about embedded computers is included in this Newsletter. Enjoy!
Wolfgang Patelay
Technical Editor, EPN
COM-Express Design Kits (RadiSys)
RadiSys has announced the introduction of a family of comprehensive COM-Express design starter kits that aim to streamline product development. Manufacturers of equipment for imaging, industrial-automation, gaming, and test & measurement applications can now obtain the hardware they need for COM-Express prototyping by using a single order code.
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Com-Express Module (Congatec)
Congatec has introduced the Conga-CMEN, a COM-Express module based on Intel's latest low-power platform for mobile computing, Menlow. Fabricated using the most up-to-date 45nm process and Hi-K dielectric technology, the platform comprises the Silverthorne processor, coupled with the Poulsbo chipset, which features integrated 3D graphics.
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Secure Embedded Wi-Fi Module (Lantronix)
The MatchPort b/g Pro is a secure embedded Wi-Fi networking solution for data-sensitive, regulatory, and IT-driven applications that demand the safest and most reliable technology, such as medical records, financial transactions, and government data.
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High-Density AMC Modules (N.A.T.)
The NAMC-8560-xE1/T1/J1 board solution has a choice of four or eight E1/T1/J1 telecom interfaces and one Gigabit Ethernet interface at the front panel. Signalling packages, such as SS7 or ISDN, allow customers to run the module as a ready-to-use box solution or to integrate their own software by using off-the-shelf board-support packages.
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Shattering the Myths of Remote Device Management
In recent years, many people have stated that affordable and easy remote M2M communication is just around the corner. But that´s not the truth. The article by Joel K. Young from Digi International discusses intelligent remote device management and describes how it is here, has been here and continues to evolve at a rapid pace.
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Merging Thermal Management and EMI Considerations
Advances in the miniaturisation of electronic components plus the complexity of system designs have rapidly accentuated the need of manufacturers to solve multiple problems simultaneously. This article by Keith McDonald from Laird Technologies shows that dealing with issues such as thermal management and EMI protection quickly and early in the design phase of a project will save you time and money in manufacturing, and it is likely to bring the product to market a lot quicker, too.
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Single-supply circuit measures 48V high-side current
The nominal -48V rail, which finds wide use in wireless base stations and other telecommunications equipment in network central offices, can vary from -48 to -60V. Measuring its current draw typically requires components that operate on ±15V dual supplies. Eliminating the negative supply would reduce system complexity and cost. This Design Idea by Wenshuai Liao, Analog Devices, Beijing, China; Stephen Lee, Analog Devices, Wilmington, Massachusetts; and Yanhui Zhao, Beihang University, Beijing, China, uses an AD629 difference amplifier and an AD8603 operational amplifier, both from Analog Devices, to measure current at -48 to -60V and operates from a single positive-power supply.
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Three-state switch interface uses one microcontroller pin
Human interfaces for electronic gadgets sometimes require three states for control. This Design Idea by Kartik Joshi and Netaji Subhas, Institute of Technology, New Delhi, India, presents a way to sense three states of an SPDT /single-pole/double-throw) switch with a center-off state, using only a single pin.
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4| Market Research |
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The Itty-Bitty Base Station Revolution—Worldwide Micro, Pico, and Femtocell Market Analysis
One of the biggest challenges facing wireless subscribers is a lack of indoor coverage. The timing of 3G service rollouts is making this problem more relevant, as carriers realize that 3G services will have limited success without addressing the indoor coverage issue. The cost to address these shortcomings with traditional macro base station solutions is too high and not possible for most mobile operators. Microcells, picocells, and femtocells address these challenges in a much more cost-effective manner. This Instat report looks at the key market players for microcells, picocells, and femtocells and the business case affecting demand. Also included is a five-year forecast for these segments, including regional forecasts.
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5| Book of the Month |
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Electronics - Circuits and Systems, 3rd Edition, by Owen Bishop
The coverage of Electronics – Circuits and Systems has been carefully matched to the electronics units of the 2007 BTEC National Engineering and the latest AS and A Level specifications in Electronics from AQA, OCR and WJEC. The third edition includes five new chapters on electrical and magnetic fields, diodes, oscillators, integrated circuits, and industrial process control systems, and several other chapters have been expanded to reflect the increasing importance of digital electronics and microcontroller systems. A free companion website features: animated diagrams showing electronic circuits in action, calculators for electronic formulae, interactive worksheets and multiple-choice tests with help prompts and answers, answers to the numeric end of chapter revision and to all multiple choice questions in the book, extra maths support, and PowerPoint presentation of a selection of illustrations from the textbook, for use in presentations and handout.
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